Global Semiconductor Manufacturing Industry Set for Q4 2023 Recovery
全球半導體制造業(yè)有望在2023年第四季度實現(xiàn)復蘇

The global semiconductor manufacturing industry is on track for recovery in the fourth quarter of 2023, setting the stage for continued growth in 2024, SEMI announced in its Q3 2023 publication of the Semiconductor Manufacturing Monitor (SMM) Report, prepared in partnership with TechInsights.

SEMI在與TechInsights合作編寫的2023年第三季度半導體制造監(jiān)測(SMM)報告中表示，全球半導體制造業(yè)有望在2023年第四季度復蘇，為2024年的持續(xù)增長奠定基礎。

Electronic sales are predicted to register a robust 22% quarter-over-quarter increase in Q4 2023, adding to 7% growth posted in Q3 2023. IC sales are expected to rise 4% sequentially after improving 7% in Q3 2023 as end demand improves and inventories normalize.

電子銷售預計在2023年第四季度將有強勁的季度環(huán)比增長，繼2023年第三季度的7%增長之后，再增加22%。IC銷售預計將在2023年第四季度在改善的需求和庫存正常化的背景下環(huán)比增長4%，在2023年第三季度已經(jīng)實現(xiàn)了7%的增長。

Despite the improvement in electronics and IC sales, semiconductor manufacturing indicators remain soft. Fab utilization rates and capital expenditures continue to decline in the second half of this year. Overall, CapEx on non-memory is expected to outperform memory in 2023, but even spending in the non-memory segments has begun to weaken. Total capital expenditures in Q4 2023 are hovering at the levels seen in Q4 2020.

盡管電子和IC銷售有所改善，但半導體制造指標仍然偏軟。上半年工廠利用率和資本支出繼續(xù)下降。總體而言，非內(nèi)存領域的資本支出預計將在2023年超過內(nèi)存，但即使在非內(nèi)存領域，支出也已經(jīng)開始減弱。2023年第四季度的總資本支出正處于2020年第四季度的水平。

While overall semiconductor capital equipment sales are declining in line with capital expenditures, the contraction in wafer fab equipment spending has turned out to be much shallower than expected this year. Furthermore, back-end equipment billings are projected to increase in Q4 2023.

雖然整體半導體資本設備銷售與資本支出同比下降，但晶圓廠設備支出的收縮幅度遠低于今年的預期。此外，預計2023年第四季度后端設備出貨將增加。

“While semiconductor markets have seen year-over-year declines the last five quarters, year-over-year growth is expected to return in the fourth quarter of 2023 as production cuts have worked their way through the supply chain,” said Boris Metodiev, director of Market Analysis at TechInsights. “On the other hand, front-end equipment sales have been performing much better than the IC market, buoyed by government incentives and the filling of backlogs, strength expected to continue next year.”

TechInsights市場分析總監(jiān)Boris Metodiev表示：“雖然半導體市場在過去的五個季度中出現(xiàn)同比下降，但預計2023年第四季度將實現(xiàn)同比增長，因為生產(chǎn)削減已經(jīng)在供應鏈中傳導開來。另一方面，前端設備銷售表現(xiàn)得比IC市場好得多，得益于政府激勵和訂單積壓的填充，這種強勁勢頭預計將在明年繼續(xù)。”

“Despite low fab utilization rates and slowing capital expenditures in the second half of 2023, we expect back-end equipment billings to bottom in Q4 2023,” said Clark Tseng, senior director of Market Intelligence at SEMI. “This will mark an important turnaround for the chip manufacturing industry, signaling a recovery from the downturn with building momentum in 2024.”

“盡管上半年工廠利用率低下，下半年資本支出放緩，我們預計2023年第四季度后端設備的出貨將觸底，”SEMI市場情報高級總監(jiān)Clark Tseng表示。“這將標志著芯片制造行業(yè)的重要轉(zhuǎn)折，預示著從2024年開始的增長勢頭。”

The Semiconductor Manufacturing Monitor (SMM) report provides end-to-end data on the worldwide semiconductor manufacturing industry. The report highlights key trends based on industry indicators including capital equipment, fab capacity, and semiconductor and electronics sales, and includes a capital equipment market forecast. The SMM report also contains two years of quarterly data and a one-quarter outlook for the semiconductor manufacturing supply chain including leading IDM, fabless, foundry, and OSAT companies.

《半導體制造監(jiān)測報告》提供了全球半導體制造業(yè)的端到端數(shù)據(jù)。該報告根據(jù)包括資本設備、工廠產(chǎn)能、半導體和電子銷售在內(nèi)的行業(yè)指標突顯了關鍵趨勢，并包括資本設備市場的預測。SMM報告還包含兩年的季度數(shù)據(jù)和半導體制造供應鏈的一個季度展望，其中包括主要的IDM、無廠半導體、代工廠和OSAT公司。